MA200 Compact

Combining High Resolution with High Throughput and Submicron Precision

With the MA200Compact SUSS MicroTec has designed a new state-of the art mask aligner platform for wafers up to 200mm that set standards in respect to alignment accuracy, high resolution, 3D patterning over topography and a high level of automation.

The MA200Compact combines proven mask aligner technology with a variety of innovative features that make it the system of choice for thick resist MEMS applications (i.e. Inkjet Heads, accelerometers, HDD), Advanced Packaging (i.e. Electroplating Bump Process, RDL), Compound Semiconductor (i.e. HBLED) and Micro Optics (i.e. Wafer Level Camera)

Product Highlights

 

  • Alignment Accuracy: 0.5µm (Direct Align option)
  • Resolution: 3 µm (proximity) / 0.8-1 µm (vacuum contact)
  • Bottomside alignment
  • Throughput: > 100 wph (including auto-alignment)
  • ThermAlign option enables to meet most demanding overlay criteria

 

Technologies

 

Upgrades

Photo Gallery

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