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PM8WLR

Wafer-Level Reliability Testing for Wafers up to 200 mm

  • Get your data fast with multi-site reliability test at wafer-level
  • Save costs with on-wafer reliability testing before the packaging process
  • High accuracy with optional ProbeShield® Technology
  • Long-term tests at temperatures from -60°C to 300°C
  • Simple ergonomic operation with large microscope movement and pull-out chuck

Developed to meet the critical needs of 90 nm or smaller process technologies used by semiconductor manufacturers, the SUSS PM8WLR probe system provides long-term process reliability measurements at temperatures up to 300°C. The prober itself is built using SUSS renowned stability, and provides the ideal platform for long-term measurements at high temperatures.

Multi-site probe cards can be easily integrated with the probe station and reduce test times to a minimum. Therefore, you have more reliability data for design and process improvement much faster than when testing packaged devices. Additionally, reliability testing before the packaging process eliminates significant costs.

SUSS’ unique design concept guarantees that handling is simple and ergonomic. Aligning the multi-site probe card is easy because the microscope movement allows you to move the field of view over the entire wafer. All controls are placed in comfortable locations and a high-resolution chuck stage ensures accurate positioning. Wafer-loading and unloading is easy with the smooth-glide pull-out chuck.