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- Semi-Automated Wafer Bonder CB200M
CB200M Semi-Automated Wafer Bonder
High Performance Wafer Bonding for advanced MEMS, 3D stacking and LED applications
Achieve unmatched pressure uniformity, alignment stability and thermal performance with the CB200M wafer bonder for MEMS, 3D stacking and LED bonding applications. This 200mm semi-automatic wafer bonder has two components, the CB200 module and the 200M cart loader which loads wafers into the CB200 bond module. Use the CB200M for research and development and for full production, simply remove the loader and dock the CB200 module onto a CBC200 cluster tool.
Patent pending CB technologies Pressure Column Design, Rigid Superstructure, and Symmetric Top and Bottom Heater Design are incorporated into the CB200M.
Product Highlights
- Use the CB200M with cart loader for development, then remove the loader and dock the CB200 module onto a CBC200 cluster tool for full production
- Patent Pending CB Technologies:
- Pressure Column Design
- Promotes pressure uniformity across entire surface of wafers
- Rigid Superstructure
- Isolates load support structure from process chamber
- Symmetric Top and Bottom Heater Design
- Multi-Zone Heating eliminates conductive heat losses
Technologies
Information Materials
Technical Publications
- Enabling Thin Wafer Metal to Metal Bonding through Integration of High Temperature Polyimide Adhesives and Effective Copper Surface Cleans
- Metal Based Wafer Bonding Techniques for Wafer Level Packaging
- Latest Metal Technologies for 3D Integration and MEMS Wafer Level Bonding
- Enabling next-generation MEMS devices with metal eutectic bonding
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