XBC300 Permanent & Temporary 300mm Wafer Bonder

Process Development and Production for Advanced 3D Integration Applications

The XBC300 Production Wafer Bonder offers both lower entry price as well as process flexibility for 300mm to configure all common process options for permanent and temporary bonding. Its innovative cluster design features three modules that can be easily interchanged in the field to accommodate changing process requirements or production needs. The process modules are configurable for all major bonding processes needed for 3D applications such as Cu-Cu bonding, polymer bonding, fusion bonding and temporary bonding for thin wafer handling. A wide range of temporary bond processes and materials is supported by the XBC300.

The XBC300 delivers submicron post bond alignment for high density and small pitch TSV manufacturing. Pressure and temperature are applied across 100% of the wafer with all clamping and holding mechanisms outside the wafer area to optimize device yield.

SUSS Cluster 7.0 Software can run multiple recipes from the same cassette and has the capability to load new recipes without waiting for the tool to unload. The intuitive software also allows for easy programming of process recipes.

• XBC300 Datasheet

• Technical Data

• Enabling Thin Wafer Metal to Metal Bonding through Integration of High Temperature Polyimide Adhesives and Effective Copper Surface Cleans  
• Metal Based Wafer Bonding Techniques for Wafer Level Packaging  

• SUSS MicroTec workshop zeroes in on wafer thinning and handling issues
• SUSS MicroTec Bonders for Temporary and Permanent 3D Bonding Solutions
• TSVs: just the tip of the 3D ICeberg