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Wafer Bonder
For over a decade SUSS MicroTec has been a leader in advanced wafer bonding technology for the MEMS industry, offering high-performance solutions for the MEMS, 3D interconnect and Optoelecronic markets.
Automated Bond Cluster
Permanent & Temporary Wafer Bonding Systems – 3D Integration, 3D Stacking, 3D IC, Advanced MEMS & Conventional MEMS Manufacturing
XBS300 Temporary Wafer Bonder (Wafer sizes up to 300mm)
XBC300 Production Wafer Bonder (Wafer sizes up to 300mm)
CBC200 Advanced MEMS Bond Cluster (Wafer sizes up to 200mm)
ABC200 Bond Cluster (Wafer sizes up to 200mm)
Cluster Modules: SB200 | CB Wafer Bonding Modules | BA300UHP | BA200Gen2 | CL200 / CL8 Cleaner/Bonder
Semi-Automated Wafer Bonders
Wafer Bonders for process development, pilot & pre-production for LED, MEMS and 3D applications.
CB200M High Performance Wafer Bonder | SB6e/8e Semi-Automated Bonder
Manual Wafer Bonders
Wafer Bonders designed for research, development and pre-production environments
Stand-Alone Related Tools
Aligners, cleaners, surface conditioning systems to support your wafer bonding needs.
Bond Aligner: BA6 / BA8 | BA8 Gen3
In-situ Cleaning/Bonding Systems: CL200 / CL8 Cleaner / Bonder