SB200 Wafer Bonding Process Module

The SB200 is a wafer bonding process module for use in the fully-automated, computer controlled ABC200 cluster system. The SB200 bonding chamber features high performance silicon carbide pressure plates, independent upper and lower substrate heaters, precise programmable force control during the wafer bonding process, and a rigid vacuum chamber for best-in-class post-bond alignment accuracy.

Combined with the SUSS Bond aligner BA200 Gen2 within an ABC200 system, the SB200 provides superior post bond alignment, force and temperature control. Bonder recipes are easily created, controlled, and monitored with SUSS MicroTec's industry-leading software platform.

Part of the ABC200 wafer bonding cluster system, the SB200 is ideal for MEMS, wafer level packaging and optoelectronic applications.

• ABC200 Datasheet