News Archive 2007
Sign up for our News Alert or use our RSS feed option 
to get the release straight away!
December
- 05/12/2007SUSS MicroTec AG appoints new VP Strategic Business Development
November
- 21/11/2007SUSS MicroTec Receives Multiple Wafer Level Packing Equipment Orders from ASE
September
- 25/09/2007Leaders in 3D Packaging Equipment Announce Seminar Series on Integrated Process Solutions
- 11/09/2007Rohm and Haas Purchases Coating Cluster from SUSS MicroTec for Resist and Spin-on Dielectric Qualification
- 04/09/2007SUSS MicroTec and STS take MEMS Technology Roadshow to Europe
August
- 14/08/2007SUSS MicroTec Announces New 200mm Coater Chose by HD MicroSystems to Support Polymide Material Technologies
July
- 30/07/2007SUSS MicroTec Announces New Gamma XPress
- 19/07/2007SUSS MicroTec launches the iVista™ High-Resolution Digital Microscope
- 18/07/2007SUSS Announces 300mm SOI Bonding System
- 17/07/2007SUSS MicroTec Unveils New ProbeShield® Technology
June
- 29/06/2007SUSS MicroTec Ranks First Place Again in VLSI Research 10 BEST Awards for Material Handling Suppliers
May
- 15/05/2007SUSS MicroTec AG appoints new Chief Financial Officer
- 11/05/2007SUSS MicroTec Strengthens Application Support Network
- 09/05/2007SUSS Unveils Next Generation Wafer Bonding Technology
- 08/05/2007Grundfos Uses Spray Coater from SUSS MicroTec for Pressure Sensor Production
- 02/05/2007SUSS MicroTec Unveils New Metrology Equipment for MEMS Production
April
- 23/04/2007SUSS MicroTec unveils the KADETT; a New High Accuracy Placement and Bonding System for R&D
March
- 27/03/2007Infotonics Selects SUSS Bonding Systems for MEMS Development Center
- 21/03/2007SUSS and STS Launch MEMS Technology Roadshow
February
- 08/02/2007SUSS Bonders Selected for MEMS Research Lab in Mexico
- 05/02/2007Epson Selects MA200Compact Mask Aligner from SUSS MicroTec for Wafer Level Chip Scale Packaging