SUSS MicroTec Announces 300 mm ProbeShield System Order
ProbeShield® Technology chosen over competition in head-to-head comparison at major Asian memory manufacturer
“The engineers at the manufacturer chose ProbeShield Technology due to the superior measurement results and significant time savings the advanced feature sets provide„
— Rob Carter, Vice President of Marketing and Sales for SUSS MicroTec Test Systems
DRESDEN, Germany, 4 September 2008 - SUSS MicroTec Test Systems has announced that it has received an order for the PA300PS with ProbeShield® Technology, the 300 mm wafer-level probe system for device characterization and reliability test, from a major Asian semiconductor memory manufacturer.
The decision follows a six-month, head-to-head comparison against the incumbent and major competition for wafer-level test solutions at the manufacturer’s facilities. During this time, several benchmarking activities were undertaken. These consisted mainly of advanced tests of semiconductor devices, such as flicker noise, I-V, C-V and S-parameter measurements, which are used to extract critical parameters in the device design and process control phases. SUSS MicroTec’s ProbeShield Technology consistently outperformed the competitive solutions, leading to its ultimate selection.
“The engineers at the manufacturer chose ProbeShield Technology due to the superior measurement results and significant time savings the advanced feature sets provide,” said Rob Carter, Vice President of Marketing and Sales for SUSS MicroTec Test Systems. “They were particularly impressed with the unattended test capabilities that are provided with the unique Automated Thermal Management™ (ATM) and ReAlign™ functions.”
The ATM and ReAlign features enable test procedures to run through the night and weekends at multiple temperature settings without operator intervention to re-align the probe tips to the test pads on the wafer each time temperature changes.
