SUSS Report
Our semiannual SUSS Report provides you with interesting technical articles about SUSS’ innovative solutions. Interested to find out what it is? Have a look in our archive.
Click here to sign up for the SUSS magazine for customers and partners.
Issue July 2008
Full View: The Age of 3D Integration
We are approaching the age of 3D integration – in fact, we are already there. And SUSS is right ahead to help our customers maximize their wafer’s real estate. And maximize their profit. As their success is our success.
C4NP Next Generation Wafer Bumping
Solder bumps were invented almost half a century ago – an eternity in today’s world of micro electronics. The technology has not stood still and many advances have been made in the areas of solder and UBM (Under Bump Metallurgy) materials, solder deposition techniques and equipment technology. The basic principle however remained unchanged: A UBM feature is created on open pads of a semiconductor chip.
Precision Wafer to Wafer Packaging Using Eutectic Metal Bonding
Eutectic metal bonding of wafers is used in advanced MEMS packaging and 3D integration technologies. A unique feature of eutectic metals is the melting of the solder like alloys that facilitate surface planarization and provide a tolerance to surface topography and particles. Often it is assumed that the alignment in eutectic metal bonding is compromised from the liquid phase transition and precision alignment is not possible. This is not true in advanced wafer level bonding using 2-3um thick metal layers. Precision control of bonding force and temperature prevent the aberrant viscous flow of the metal and prevent wafer slippage. Keywords: Eutectic bonding, wafer bonding, MEMS packaging, Au-Sn, Au-Si, Cu-Sn.
Application Notes: Tips to Get the Most Out of Data Viewer
The graphical user interface for all SUSS bonder products is called the Process Control Program (PCP) Navi-gator. One of the lesser used components available in this navigator is the “Data Viewer”. It is accessed by clicking the Navigator Data button. The Data Viewer graphically displays the contents of selected process data files and allows customization and export of process data. This note will discuss the common and not-so-common but helpful functions available in the Data Viewer.
New Office in USA
Introducing the Certified Remanufactured line of SUSS quality products now in the United States.
Clif’s Notes: You Can Define That Exposure Dose in One Wafer!
There are many ways to determine the best exposure dose for a SUSS 1X full field aligner. Many times it seems easiest to just run a group of wafers each at a different exposure time. This method however takes time and resources which adds cost to process. There are some very simple and easy methods to reduce the cost of an evaluation yet still provide the most information at the least cost.
Click here to sign up for the SUSS magazine for customers and partners.
