Company
- SUSS Group
- Locations
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- News
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- Glossary of Technical Terms
Investor Relations
Products
- Lithography
- Wafer Bonder
- Test Systems
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  - ProbeShield Technology
  - Manual Systems
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  - Accessories
  - |Z| Probe Technology
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- Device Bonder
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  - Tools
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Technologies
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- 3D Integration
  - 3D Packaging
  - Thick Photoresists
  - High Topography
  - 3D Interconnect
  - TSV Manufacturing
  - Stacking Technologies
- Wafer Level Packaging
  - Wafer Bumping
- MEMS / Nanotechnology
- Compound Semiconductor/LED

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China

SUSS MicroTec (Shanghai) Co. Ltd.

Room 3703, Nanzheng Building, 580 Nanjing West Rd.,

200041 Shanghai

China

Phone:+86 21 52340432

Fax: +86 21 52340430

Email:l.gong@suss.com.cn