• Company
  • SUSS Group
    • Company Profile
    • Managing Board
    • Financial Figures
    • History
  • Locations
    • North America
    • USA
    • Asia
    • China
    • Japan
    • Taiwan
    • Thailand
    • Singapore
    • Europe
    • Germany
    • France
    • Switzerland
    • United Kingdom
  • News
    • Press Releases
    • Financial News
    • SUSS Report
    • SUSS in the News
  • Events
  • Careers
  • Alliances
  • Contact
  •  
  • Glossary of Technical Terms
• Investor Relations
  • Company Profile
    • Managing Board
    • Key Figures
  • Corporate Governance
    • Declaration of Compliance
    • Ownership of Shares & Subscription Rights
    • Directors' Dealings
    • Document under §10 WpPG
  • Share Quotation
    • IPO Parameter
    • Shareholder Structure
    • Directors' Dealings
  • Ad hoc & Press Releases
  • Voting Rights Announcements
    • Total Voting Rights Announcements
  • Reports
  • Financial Calendar
  • Shareholder Meeting
  • IR Contact
• Products
  • Lithography
    • Spin/Spray Coater
    • Mask Aligner
    • Lithography Cluster
    • Alignment Verification
    • Photomasks
    • Wet Processing
    • Nanoimprint Lithography
  • Wafer Bonder
    • Automated Bond Cluster
    • Semi-Automated Wafer Bonders
    • Manual Wafer Bonder
    • Stand-Alone Related Tools
  • Test Systems
    • Probe Systems
    • ProbeShield Technology
    • Manual Systems
    • Semiautomatic Systems
    • Fully Automated Systems
    • Dedicated Systems
    • Accessories
    • |Z| Probe Technology
    • Software Solutions
    • Further Accessories
  • Device Bonder
  • C4NP
    • Tools
  • Micro-optics
  • Remanufactured Equipment
  • Training
  • Service
• Technologies
  • Lithography
    • Standard Photoresist
    • Thick Photoresist
    • High Topography (3D)
    • Polyimide Processes
  • Wafer Bonding
    • MEMS
    • Optoelectronics
  • Testing
    • Device Characterization & Modeling
    • Process Control & Reliability
    • Failure Analysis
    • Optosemiconductor Test
    • MEMS Test
    • Functional Test
  • C4NP
  • Nanoimprint Lithopgraphy
    • UV-NIL
    • Hot Embossing
  • Engineered Substrates
• Markets
  • 3D Integration
    • 3D Packaging
    • Thick Photoresists
    • High Topography
    • 3D Interconnect
    • TSV Manufacturing
    • Stacking Technologies
  • Wafer Level Packaging
    • Wafer Bumping
  • MEMS / Nanotechnology
  • Compound Semiconductor/LED
    • Process Equipment
    • Wafer Bonding for LEDs
    • Optosemiconductor Test

SUSS MicroTec France S.A.S