3D Interconnect
With increasing interconnect densities and increasing cost of IC designs in leading edge technology nodes 3D architectures for IC design and packaging are becoming viable alternatives to the standard 2D designs.
In particular memory applications have started to adopt 3D stacking due to the even more stringent requirements for increased memory densities and reduced footprint. Consumer devices like mobile phones have been the major driver for 3D stacking.
SUSS MicroTec is committed to providing world class processing equipment for 3D Packaging, 3D Integration and Thin Wafer Handling. Sub-micron alignment accuracy combined with unmatched process parameter control allows us to meet today’s and future 3D processing requirements.
