Company
- SUSS Group
- Locations
  - North America
  - USA
  - Asia
  - China
  - Japan
  - Taiwan
  - Thailand
  - Singapore
  - Europe
  - Germany
  - France
  - Switzerland
  - United Kingdom
- News
- Events
- Careers
- Alliances
- Contact
- Glossary of Technical Terms
Investor Relations
Products
- Lithography
- Wafer Bonder
- Test Systems
  - Probe Systems
  - ProbeShield Technology
  - Manual Systems
  - Semiautomatic Systems
  - Fully Automated Systems
  - Dedicated Systems
  - Accessories
  - |Z| Probe Technology
  - Software Solutions
  - Further Accessories
- Device Bonder
- C4NP
  - Tools
- Micro-optics
- Remanufactured Equipment
- Training
- Service
Technologies
Markets
- 3D Integration
  - 3D Packaging
  - Thick Photoresists
  - High Topography
  - 3D Interconnect
  - TSV Manufacturing
  - Stacking Technologies
- Wafer Level Packaging
  - Wafer Bumping
- MEMS / Nanotechnology
- Compound Semiconductor/LED

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Ad hoc and press releases 2008

August
Aug 14Ad hoc Announcement: SUSS MicroTec AG Decides Presently Against Sale of Test Systems Division
Aug 12Ad hoc Announcement: SUSS MicroTec AG: High Order Entry Again in the Second Quarter
May
May 6Ad hoc Announcement: SUSS MicroTec AG: High Order Entry, Positive Earnings in the First Quarter
March
Mar 28Ad hoc Announcement: SUSS MicroTec AG: Figures Released for the 2007 Fiscal Year
February
Feb 7Ad hoc Announcement: Preliminary Figures for the 2007 Fiscal Year