Adhoc and press releases 2005
December
- 13/12/2005Press release: SUSS MicroTec wins significant MEMS order in China
November
- 08/11/2005Ad-hoc Announcement: SUSS MicroTec AG publishes nine-months report
October
- 27/10/2005Press release: SUSS MicroTec Receives Three Production Wafer Bonder Orders
September
- 08/09/2005Ad hoc Announcement: SUSS MicroTec Announces IBM Order for High Volume C4NP Bumping Line
- 08/09/2005Press release: SUSS MicroTec Announces IBM Order for High Volume C4NP Bumping Line
August
- 26/08/2005Ad-hoc Announcement: SUSS MicroTec AG has successfully concluded its capital increase with rights issue
- 05/08/2005Ad-hoc Announcement: SUSS MicroTec Increases Capital Stock
July
- 29/07/2005Ad-hoc Announcement: SUSS MicroTec AG increases operating results
June
- 20/06/2005Press release: SECAP Disbands After Successfully Achieving Goals
May
- 10/05/2005Press release: SUSS MicroTec Receives Strategic 300mm Order from Major Taiwanese Semiconductor Assembly and Test Facility
- 03/05/05Ad hoc Announcement: SUSS MicroTec AG: Results for Q1/2005
March
- 22/03/05Ad-hoc Announcement: : SUSS MicroTec AG: Results 2004 and further cost savings initiatives
January
- 26/01/05Ad-hoc Announcement: : SUSS MicroTec: Preliminary 2004 Results
