MA6/8
Enhance the Capability of SUSS MA6/8 Mask Aligners using Nanoimprint Technology
Features and Benefits
- Printing down to sub 50nm geometries (resolution depends on stamp and resist)
- New UV-NIL toolset can now be easily field-installed on SUSS MA6/8 Mask Aligners
- Variable stamp and substrate sizes allow highest process flexibility
- Easy and fast switching between UV-lithography and nanoimprint lithography
The capabilities of the MA6/8 Mask Aligner are now enhanced with new tooling that enables optimized results for single imprint UV-NIL The MA6/8 imprinting technology supports a variety of materials such as UV glues, photoresists or polymers.
SUSS UV-NIL enhanced aligners are capable of printing resist thicknesses from less than 0.1 micron to a few hundred microns with a printing down to a few nm (stamp dependent). In-situ top or bottom side alignment and specific UV curing wavelengths can be selected. Typically the stamp or mold is made of UV transparent material like quartz. In the absence of a clear stamp, Si or Ni stamp may be used. In this case the wafer has to be UV transparent. Opaque stamps such as Ni or Si may also be used with UV-transparent wafers.
