Mask Aligner
Unmatched Precision for Thin and Thick Film Applications
The SUSS Mask Aligner has become synonymous with superior quality, accuracy, and high quality exposure equipment. SUSS MicroTec offers a complete range of mask aligners for high-end fab automation, volume production and R&D environments alike. The new mask aligner generation from SUSS processes wafers up to 300mm and can be equipped with technologies that significantly increase throughput, achieve 1 micron resolution and sub-micron overlay and significantly reduce lithography costs. SUSS Mask Aligners provide a flexible and economic alternative to expensive stepper technology and are regarded as the system of choice for many enabling technologies such as MEMS, Wafer Level Packaging or Compound Semiconductors.
Production Mask Aligners
MA300Plus
wafers: for 200mm and 300mm wafers
square and rectangular substrates on demand› read more...
MA200Compact
wafers: 2" to 200mm
square and rectangular substrates on demand› read more...
MA150e
wafers: up to 150mm wafers
square and rectangular substrates on demand› read more...
Manual Mask Aligners
MJB4
wafers: up to 4"
substrates: up to 4"x4"› read more...
MA/BA6 - Combined Mask&Bond Aligner
wafers: up to 6"
substrates: up to 6"x6"› read more...
MA/BA8 - Combined Mask&Bond Aligner
wafers: up to 8"
substrates: 1"x1"-8"x8"› read more...


