MA200 Compact
Features and Benefits
- Alignment Accuracy: 0.5µm (Direct Align)
- Wafer Size: up to 200mm
- Resolution: 3 µm (proximity) / 0.8-1 µm (vacuum contact)
- Bottomside alignment
- Throughput: > 100 wph (including auto-alignment)
The MA150/200 Compact represents the next generation of production full-field lithography systems. This new production aligner platform offers a higher overlay accuracy, more flexible wafer handling including reject and buffer cassette option and SECS II/GEM functionality.
The novel DirectAlign system achieves an alignment accuracy down to 0.5µm. This leads to an increased process window for a variety of applications, such as thick resist flip chip bumping and wafer level packaging applications, MEMS and Nanotechnology, as well as telecommunication devices.
