MA300
Features and Benefits
- Full-field intensity 90mW/cm²(broad band)
- 100 percent edge exposure flexibility (easy EBR)
- Resolution down to 3 µmm
- Alignment accuracy 1 µm, with DirectAlign option 0.5µm (3 sigma)
- Can be equipped with a dedicated alignment kit for creating 3D interconnects
The second generation of the SUSS MA300 is a highly automated mask aligner platform for 300mm and 200mm wafers. It is specifically designed for 3D Packaging, wafer bumping and wafer level packaging applications but can be used as well for other technologies where geometries in the range of 5 and 100 microns have to be exposed. The MA300 represents a new generation of mask aligners from SUSS that are designed to address the requirements of modern high-end fabs in a high volume manufacturing environment.
In addition to the standard topside alignment with accuracies down to 0.5µm (DirectAlign) the new 3D dedicated alignment platform enables bottom side and infrared alignment for 300 mm based three-dimensional (3D) packaging lithography applications such as etch masks for TSVs and dicing streets, backside redistribution layers (RDLs) or bumping applications. While bottom-side alignment enables SUSS 300mm Mask Aligners to process double-sided structured wafers, the infrared alignment option allows the handling of opaque, yet IR-transparent materials such as adhesives, in particular for thin wafer handling or encapsulation applications.
Unlike steppers proximity mask aligners are very efficient when exposing very thick layers. Mask aligners offer large process windows because they don't have the depth of focus limitations known from projection systems.
