MicroAlign™ and ReAlign™ Technologies
Intelligent Automation Tools for Next-Generation Devices
Features and Benefits
- Automated probe-to-pad alignment for vertical probe cards
- Accurate alignment even for the smallest (< 40 µm) pads
- Unattended, automatic re-alignment of the system after temperature changes
- Intuitive, user-friendly wizard-based software interfaces
- Available with any ProbeShield® system
As semiconductor devices get smaller, so do test structures and pad sizes (< 40 µm). Additionally, probing on bumped wafers is becoming more common. For these fine-pitch and bump array probing applications, a standard cantilever probe card is impractical. Instead, vertical probe cards must be used, which poses a significant challenge to the operator: How to align the probe tips with the pads/bumps without being able to see through the card?
The innovative solution is MicroAlign™ Technology from SUSS, available with as a ProbeShield system. The unique camera system along with an easy-to-use software package integrated into the ProberBench™ operating system automates the probe-to-pad alignment. The entire process, led by an intuitive software wizard, takes less than five minutes.
As you probe at different temperatures, system alignment needs to be adjusted to account for thermal shift. SUSS’ ReAlign™ Technology automatically re-aligns the probe tips of the probe card to the pads after temperature changes. This automated tool can be integrated into any ProbeShield system, and is driven simply by the software command “ReAlign”. Probing at different temperatures has never been easier.
