ABC200 Automated Wafer Bonding Cluster System
State-of-the-Art Production Wafer Bonding
Features and Benefits
- Configurable for wafers up to 200mm
- Smallest Industry Footprint (from 1.2m x 1.4m and up to 6 modules available)
- Uninterrupted operation while running multiple recipes and multiple process flows (anodic bonding, eutectic bonding, silicon fusion bonding, adhesive, thermo-compression or glass frit)
- Multi-chamber configurations enables different bond process to run simultaneously, e.g. triple stack anodic bond, and in a second step eutectic bonding
The SUSS ABC200, production wafer bonding cluster, offers superior process performance and unsurpassed productivity. Configurable for up to 200mm wafer sizes the ABC200 is based on different modules that can be put together according to the various needs and applications. The fully automatic cassette to cassette operation opens the door to high volume production with unmatched yield.
This generation's ABC200 substrate bond module supports all common bonding technologies, as well as mixed applications and is especially optimized for aligned fusion bonding, adhesive, thermo-compression and anodic triple stack bonding.
The ABC200 offers uninterrupted operation while running multiple recipes and multiple process flows. All cluster systems have reduced size and space requirements with a minimum footprint configuration of 1.2 x 1.4 m. The system can be quickly reconfigured in the field by adding or replacing modules to keep pace with growing production needs or changes in technology requirements including in-situ metrology.
