SB6L Manual Wafer Bonding System
Cost effective, High Precision Wafer Bonder
Features and Benefits
- Up to 1µm post bond alignment capability allows better yield and opens up new applications
- One chamber designed for all types of bond processes – including anodic, glass frit, thermocompression, SOI, polymer and adhesive bonding – offers ultimate flexibility
- Processes developed on SB6L are compatible with high-volume SUSS bonding cluster systems, for easy technology transfer
You don't have to compromise performance in a manual bonder. The SB6L uses the same core bonding technology as SUSS' more automated bonders, including precise temperature and force control during bonding, active cooling and fast heating capabilities, and computer controlled wafer processing. The bonding chamber itself has the same rigid and electropolished chamber walls, silicon carbide pressure plates, and precision leveling of chucks.
SUSS' field-proven software facilitates an easy transition from R&D to pre-production and even fully-automated production processes.
The standard SB6L machine is supplied on a metal frame platform with the vacuum chamber, control electronics, and computer built-in, providing a professional integrated look. It is compatible with the large installed base of SUSS MA/BA mask aligners (over 1,300 in the field today) and innovative open-design fixtures, so you don't need to invest in alignment technology or fixtures to build your bonding capabilities.
