SB6/8e Semi-Automated Wafer Bonding System
Precision Wafer Bonding Solution
Features and Benefits
- Ideal for all wafer bond processes including anodic, eutectic, adhesive, fusion, SOI and thermocompression bonding
- Suitable for all types of wafers and substrates up to 200mm diameter, stack thickness up to 6mm
- High post-bond alignment accuracy is ensured by the SUSS transport fixture with automated wafer clamping in combination with the SUSS BA6 bond aligners
- Down to 1µm post bond alignment accuracy with Laser prebond option on the BA6/8 for anodically bonded multiple wafer stacks
- Controlled bond environment – vacuum or controlled gas ambient
The SB6/8e is a semi-automatic, computer controlled, stand-alone wafer bonder accommodating 150mm. and 200mm. wafers respectively. The SB6/8e system features a rigid vacuum chamber for best-in-class post-bond alignment accuracy, independent upper and lower substrate heaters and precise programmable force control during the wafer bonding process.
A wafer stack loading arm simplifies the loading and unloading of aligned wafers into the vacuum system. Combined with the SUSS Bond aligner BA6 or BA8 the SB6e & SB8e provides superior post bond alignment, force and temperature control. Ideal for MEMS, SOI, wafer level packaging and optoelectronic applications.
The SB6/8e can be equipped with tooling fixtures for all known bond processes for a wide range of substrate sizes of 20 x 20mm to 200mm diameter. Additionally, the SB6e & SB8e chamber, tooling, and fixtures are used in SUSS production cluster tools, the ABC200 This allows easy technology process transfer from low volume production to full mass production.
