BA200 / BA8 / BA6 Bond Aligner
Precision Bond Alignment from the Industry Experts
Features and Benefits
- Pattern and line recognition software
- Optical and IR illumination enables superior alignment
- Top-side, bottom side, and inter-substrate alignment modes
Precision post-bond alignment requires precision pre-bond alignment. The SUSS name is synonymous with precision mechanics. SUSS mask aligners are legendary for their quality, performance, and reliability. The BA200/BA8 uses the same perfected wafer alignment technology as that used in thousands SUSS mask aligners worldwide.
You can rest assured of repeatable sub-micron wafer-to-wafer bond alignments using SUSS advanced aligner technology in production, where it counts.
While the BA8/BA6 are stand-alone bond alignment systems, the BA200 is a process module that can be integrated into an ABC200 bond cluster systems.
