High Topography (3D)
Ready for the Next Generation Resists
Processes for the fabrication of 3-D microstructures are commonly found in the field of MEMS, MOEMS, and advanced packaging. Applications for pressure sensors, weight sensors, micro mirrors, and multiple other devices are moving into the third dimension, having topography steps with several microns up to 600µm and more.
For coating of such extreme topographies SUSS MicroTec has developed AltaSpray, a dedicated spray coating technology for challenging structures such as 90° corners, KOH etched cavities, V-grooves or lenses.
When an AltaSpray coater works in concert with a SUSS mask aligner that comes equipped with large gap optics and a very large depth of field excellent patterning results are achieved even over topography variations of several hundred microns.
Main Applications
- SemiconductorsDRAM, Cameras, Displays (DLPs)
- MEMSInk Jet Heads, Pressure Sensors, RF-MEMS, Accelerometers, Gyroscopes, Bio-MEMS, MOEMS, Micro Fuel cells, Probe cards, Read-Write Heads
