Polyimide Processes
Today, photo-sensitive Polyimides are widely used in Advanced Packaging. Present applications include wafer bumping (stress buffer layer) and multilevel interconnect technology at wafer level. Unlike photo resists Polyimides are part of the chip package and therefore are not stripped.
SUSS production coaters and aligners for 200 and 300mm substrates are the preferred systems for processing these high temperature engineering polymers. While SUSS coaters offers superior performance in Polyimide coating, baking and developing, SUSS mask aligners are able to precisely set the exposure gap in order to adjust the side wall profile and to suppress crowning effects.
Main Applications
- SemiconductorsMPU, MCU, CCL, DSP, DRAM, SRAM, Flash, ASIC and other Logic, Display Drivers, Analogs, Discretes, Cameras
- Compound SemiconductorsRF, Filters, III-V/ Si-integration, Sensors FPA, Power Devices
- MEMSPressure Sensors, Accelerometers, Gyroscopes
