MEMS (Microelectromechanical Systems)
Features and Benefits
- Microfabrication of MEMS Devices
- Wafer Level Encapsulation of Micromachined Devices
- Hermetic Sealing of MEMS Products
- Wafer Level Packaging - Stress Isolation, Fabrication of Cavities, Optical Windows
Wafer bonding is one of the core technologies in the microfabrication of MEMS products today. SUSS has extensive applications experience in all types of wafer bonding processes used to fabrication MEMS devices from R&D through to high volume mass production. Count on SUSS know-how and expertise in wafer bonding to bring your MEMS products to market.
