Optoelectronics
Features and Benefits
- High Brightness LED's (Light Emitting Diodes)
- High Power LED's
- Multiple Wafer Bonding
- Wafer Level Packaging
LED devices operate by spontaneously emitting light isotropically with approximately half of the light going towards the substrate itself. For high volume manufacturing of high brightness LED's wafer bonding technology can be used to bond metal mirror backing wafers to LED device wafers to increase light output. SUSS MicroTec's patent pending technology enables the simultaneous bonding of multiple wafer pairs, including metal eutectic processes, in one bond step. SUSS wafer bonding technology achieves impressive manufacturing cost reductions of LED devices while increasing throughput up to 8X.
