SUSS MicroTec: Equipment for the Semiconductor Market

Company
- SUSS Group
- Locations
  - North America
  - USA
  - Asia
  - China
  - Japan
  - Taiwan
  - Thailand
  - Singapore
  - Europe
  - Germany
  - France
  - Switzerland
- News
- Events
- Careers
- Alliances
- Contact
- Glossary of Technical Terms
Products
- Lithography
- Wafer Bonder
- Test Systems
  - Probe Systems
  - ProbeShield Technology
  - Manual Systems
  - Semiautomatic Systems
  - Fully Automated Systems
  - Dedicated Systems
  - Accessories
  - |Z| Probe Technology
  - Software Solutions
  - Further Accessories
- C4NP
  - Tools
- Micro-optics
- Remanufactured Equipment
- Training
- Service
Markets & Applications
- 3D Integration
  - 3D Packaging
  - Thick Photoresists
  - High Topography
  - 3D Interconnect
  - TSV Manufacturing
  - Stacking Technologies
  - CMOS Image Sensors
  - Packaging & Integration
- Wafer Level Packaging
  - Wafer Bumping
- MEMS / Nanotechnology
- Compound Semiconductor / LED
  - Process Equipment
  - Wafer Bonding for LEDs
- Photolithography
- Bonding Technology
- Nano Imprint Lithography
- Testing
- Wafer Bumping Applications / C4NP
Investor Relations