SUSS Investor Relations

SUSS MicroTec launches XBC300 Gen2: New Platform for permanent Wafer Bonding, Debonding and Cleaning

Mon, 06 Feb 2012 17:33:00 +0100

“The XBC300 Gen2 allows complete process flexibility with full automation and offers our customers a superior cost of ownership. While the first generation XBC300 only offered configurations with up to three process modules, the new generation can be equipped with up to six modules, enabling the high throughput required in volume manufacturing.” — Frank Averdung, President and CEO of SÜSS MicroTec AG

Garching, GERMANY, February 6, 2012 – SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, launched the XBC300 Gen2, a high volume manufacturing platform for advanced 3D processing. The new bonding equipment can be used for permanent wafer bonding, or debonding and cleaning of 200mm and 300mm wafers. It is designed for production as well as process development.

Configurable with a wide selection of process modules, the new universal bonder platform is suitable for all major permanent bonding as well as mechanical debonding processes at room temperature. The corresponding cleaning processes for 3D integration and 3D packaging are also supported. The high force bonding processes that can be run on the XBC300 Gen2 include Cu-Cu, polymer, fusion and hybrid bonding.

When configured as a debonder and cleaner the XBC300 Gen2 is the complementary platform to SUSS MicroTec’s XBS300 temporary wafer bonder, which was launched in December 2011. Device wafers are temporarily bonded to a carrier in the XBS300 and are debonded on the XBC300 Gen2 after passing all the backside processing steps. The XBC300 Gen2 debonder / cleaner is configured for handling both, carrier wafers as well as film frames. It allows for room temperature mechanical debonding and subsequent cleaning of carriers and device wafers.

“The XBC300 Gen2 allows complete process flexibility with full automation and offers our customers a superior cost of ownership. While the first generation XBC300 only offered configurations with up to three process modules, the new generation can be equipped with up to six modules, enabling the high throughput required in volume manufacturing.”, says Frank P. Averdung, President and CEO of SÜSS MicroTec AG. “With the XBS300 and the XBC300 Gen2 we offer our customers a complete, state-of-the-art set of automated equipment for thin wafer handling in 3D integration and 3D packaging processes.” Download the PDF version

Ad Hoc Announcement: SUSS MicroTec AG: Expected Q4 order entry below forecasts

Tue, 20 Dec 2011 00:00:00 +0100

Garching, December 20, 2011 – SUSS MicroTec AG (ISIN: DE000A1K0235) today announced that order entry for the fourth quarter of 2011 is expected to be between € 20 million and € 25 million. In fall 2011, the company had still been anticipating an order entry of € 30 million - € 40 million for the fourth quarter. The currently weak macroeconomic outlook translated into a cautious ordering behavior of our clients in the fourth quarter. For the full fiscal year 2011 SUSS MicroTec still expects sales of more than € 170 million and an EBIT-margin between 10% - 15%. The EBIT-margin will most likely be at the lower end of the guidance due to the increase in R&D spending in the second half of the year. As of today SUSS MicroTec expects the free cash flow to be below € 10 million for the full fiscal year 2011. End of the ad hoc announcement Download the PDF version

SUSS MicroTec launches XBS300, the next generation Temporary Bonder for 200mm and 300mm High-Volume Production

Mon, 05 Dec 2011 17:30:00 +0100

“The XBS300 Temporary Bonding System is our answer to an increasing demand for processing systems that meet the requirements of future High Volume Production expected for 2013” — Frank Averdung, President and CEO, SUSS MicroTec

Garching, GERMANY, December 5, 2011 – SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, launched the XBS300 Temporary Bonder, SUSS MicroTec’s latest generation of high volume manufacturing temporary bond systems. This Bond Cluster is configured to temporarily bond 200mm and 300mm wafers for 3D integration applications as well as other processes that require thin wafer handling. SUSS MicroTec’s XBS300 offers a high throughput capability resulting in a superior cost-of-ownership as well as a sophisticated process control to meet customers’ demands and expectations for high volume temporary bonding applications. The temporary bonding of wafers is one of the crucial process steps of 3D integration.

The XBS300 supports all currently available temporary bonding adhesives. Its versatility allows a variety of process configurations suited for very low force bonds such as the Thin Materials (TMAT) process or the 3M™ Wafer Support System (WSS) as well as higher force thermo-compression bonds as used in the BrewerScience® ZoneBOND™ process. Key process steps for temporary bonding with the XBS300 include adhesive and release layer deposition, temporary bonding and curing and integrated metrology to determine the total thickness variation (TTV).

At this point in time a number of renowned material manufacturers are working on the development of new temporary bonding adhesives that are fully compatible with SUSS’ XBS300 equipment platform.

“The XBS300 Temporary Bonding System is our answer to an increasing demand for processing systems that meet the requirements of future High Volume Production expected for 2013,” says Frank P. Averdung, President and CEO of SÜSS MicroTec AG. “The XBS300 is based on our ACS300 Gen2 cluster platform, already established in the industry as proven workhorse for high volume production, ensuring high levels of efficiency and reliability. The utilization of this common platform strategy is one of the major gains from the geographic consolidation of three product lines under one roof in our Sternenfels facility. With the XBS300 - our latest innovation - we round off a product portfolio which perfectly addresses the future requirements of our customers.”

The first tool has already been delivered to a world leading IDM with the installation currently in progress. Download the pdf version

Brewer Science and SUSS MicroTec Jointly Commercialize ZoneBOND™ Technology for Thin Wafer Handling

Mon, 05 Dec 2011 00:00:00 +0100

Garching/Munich, GERMANY / ROLLA, MO, USA, December 05, 2011 – Brewer Science, Inc., the inventor of ZoneBOND™ technology and world leading expert in materials and processes for thin wafer handling, and SUSS MicroTec, a leading supplier of equipment, are joining forces in commercializing ZoneBOND™ technology for thin wafer handling. SUSS MicroTec, market leader in room temperature debonding process equipment, is now offering the Brewer Science ZoneBOND™ process on the XBC300 and XBS300 platforms, targeted for high volume bonding and debonding of 200/300mm wafers using silicon or glass carriers. Brewer Science offers products specifically designed for the successful implementation of the ZoneBOND™ process including materials for carrier preparation, adhesives, removers, as well as small scale debonding equipment. ZoneBOND™ technology is a break-through solution for wafer handling that provides excellent total thickness variation (TTV) control, high-temperature stability, and low-stress debonding. Customers will benefit through higher yield at debonding, higher throughput, and lower cost of ownership. This joint effort combines both companies’ expertise to provide a complete material, equipment and process solution, optimized for each individual customer’s process needs.

Q3 Figures for 2011 Published

Tue, 08 Nov 2011 08:00:00 +0100

Order Intake with 38.2 € million at upper end of guidance
Sales of 45.9 € million significantly above guidance
EBIT at 4.1 € million
Net cash position increased to 40.1 € million

Garching, GERMANY, November 8 2011 - SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, published its report for the third quarter of the fiscal year 2011 today. When looking at the third quarter only, order intake decreased by 33% to 38.2 € million compared to the third quarter 2010 (Q3 2010: 56.9 € million), but increased sequentially by 19%. Sales increased by 24% to 45.9 € million, compared to 37.0 € million in the corresponding quarter 2010. The EBIT decreased by 18% in the third quarter to 4.1 € million compared to € 5.0 million in the previous year. It was influenced by the delivery of low margin - but strategically important - tools to customers for their evaluation. Additionally our research and development costs have increased significantly in the third quarter, but we see this temporary cost increase as a necessary investment into innovative process solutions and technologies. The figures for the first nine month of the year show that the company again experienced a relatively strong level of sales compared to the first nine month of 2010. SUSS MicroTec generated sales of 130.6 € million, beating the previous year of 96.6 € million by approximately 35%. Order entry decreased, as expected, by 15% year on year to 118.6 € million. This leads to an order backlog of 103.5 € million as of September 30, 2011 (September 30, 2010: 108.0 € million). The group's largest division – Lithography – posted a 28% increase in sales to 84.4€ million (previous year: 65.7 € million) during the year under review. The Photomask Equipment division also succeeded in growing its revenues by more than 260% to 25.8 € million (previous year: 7.1 € million). The Substrate Bonder division contributed sales of 14.8 € million (previous year: 19.0 € million), a decrease by 22%. Earnings before interest and tax (EBIT) of 14.7 € million could be achieved (previous year: 8.4 € million). This translates into an EBIT-margin of 11.3%. The EBIT in 9M 2011 was burdened by restructuring costs of roughly 1.4 € million caused by the relocation of the Bonder product line from Waterbury, VT, USA to Sternenfels. In the first nine months of 2010 the special effects amounted to € minus 0.2 Million, consisting of a negative goodwill of 2.7 € million and restructuring costs of 2.5 € million. The adjusted EBIT is 16.1 € million, which translates into an adjusted EBIT-margin of 12.3%. For the remainder of the fiscal year 2011 we expect no further restructuring costs. Earnings after taxes (EAT) from continuing operations amounted to 11.2 € million, compared to 3.6 € million in the previous year. The basic earnings per share (EPS), therefore, totaled 0.59 € (previous year: 0.19 €). Cash and interest bearing securities amounted to 54.7 € million at the end of the first nine month year (September 30, 2010: 39.2 € million). Net liquidity amounted to 40.1 € million (September 30, 2010: 23.5 € million). The Free Cash Flow for the fiscal year, before security transactions and extraordinary effects as well as M&A transactions, was 2.0 € (previous year: 3.8 € million).

Outlook

The Management Board confirms that it expects sales of more than € 170 million for the current fiscal year, 2011. The company also expects the EBIT-margin to improve compared with the previous year. As of today the free cash flow can reach a double digit million € figure. For the fourth quarter of the fiscal year 2011 the company expects according to our guidance an order intake of € 30 to 40 million and sales of approximately € 40 - 45 million. Download the PDF version

SUSS MicroTec AG: Divestment of SUSS MicroTec Precision Photomask Inc.

Mon, 17 Oct 2011 18:00:00 +0200

Garching, October 17, 2011 – The SUSS MicroTec AG has sold its mask manufacturing business - SUSS MicroTec Precision Photomask Inc. (formerly known as Image Technology Inc.) - in Palo Alto, California, on October 14, 2011 to Compugraphics Inc.. This move supports the expansion of the SUSS MicroTec Photo Mask Equipment business by eliminating competitive overlap with prospective customers. Synergies with the core equipment business were limited so that a deconsolidation will be possible easily. The divestment of the mask business is a further step of SUSS MicroTec to focus on its profitable and high growth core business areas. The transaction will have no effect on the consolidated income statement. Compugraphics Inc., a wholly owned subsidiary of OM Group, has acquired all the assets of SUSS MicroTec Precision Photomask Inc. and will continue operations in the US. Compugraphics is a globally acting mask manufacturer with mask shops in the US, UK and Germany. Download the pdf version

Half Year Figures for 2011 Published

Thu, 04 Aug 2011 08:00:00 +0200

Order Intake stayed at last year’s high level with € 80.4 million
Sales plus 42% to € 84.7 million
EBIT at € 10.6 million after € 3.5 million in the prior year

Garching, August 4, 2011 – SUSS MicroTec AG published its report for the first half year of the fiscal year 2011. When looking at the second quarter only, sales rose by 40% to 52.7 € million, compared to 37.7 € million in the corresponding quarter 2010. Order intake on the other hand decreased by 37% to 32.1 € million compared to the second quarter 2010. The EBIT increased to 8.1 € million compared to € 3.5 million in the previous year. The figures for the first half year show that the company again experienced an increase in sales compared to the first half of 2010. SUSS MicroTec generated sales of € 84.7 million, beating the previous year of € 59.6 million by approximately 42%. Order entry decreased slightly by 3% year on year to € 80.4 million. The group's largest division – Lithography – posted a 36% increase in sales to € 52.5 million (previous year: € 38.5 million) during the year under review. The Photomask Equipment division also succeeded in growing its revenues by more than 230% to € 20.7 million (previous year: € 6.1 million). The Substrate Bonder division contributed sales of € 7.7 million (previous year: € 12.1 million). Earnings before interest and tax (EBIT) of € 10.6 million could be achieved (previous year: € 3.5 million). This translates into an EBIT-margin of 12.5%. The EBIT in H1 2011 was burdened by restructuring costs of roughly € 1.3 million (previous year: € 0.9 million) caused by the relocation of the Bonder product line from Waterbury, VT, USA to Sternenfels. The adjusted EBIT is € 11.9 million, which translates into an adjusted EBIT-margin of 14.0%. For the remainder of the fiscal year 2011 we expect further restructuring costs of approximately € 0.7 million. Earnings after taxes (EAT) from continuing operations amounted to € 8.3 million, compared to € 1.1 million in the previous year. The basic earnings per share (EPS), therefore, totaled € 0.44 (previous year: € 0.06).

Cash and interest bearing securities amounted to € 50.6 million at the end of the first half year. Net liquidity amounted to € 35.5 million (June 30, 2010: € 25.6 million). The Free Cash Flow for the fiscal year, before security transactions and extraordinary effects as well as M&A transactions, was € -2.5 (previous year: € 6.0 Million).

Outlook

The Management Board confirms that it expects sales of more than € 170 million for the current fiscal year, 2011. The company also expects the EBIT-margin to improve compared with the previous year. As of today the free cash flow is expected to reach a double digit million € figure. For the third quarter of the fiscal year 2011 the company expects an order intake of € 30 to 40 million and sales of approximately € 35 - 40 million. Download PDF Version

SUSS MicroTec AG: 2011 Shareholders' Meeting in Munich

Wed, 22 Jun 2011 08:54:00 +0200

Garching, Germany, June 22, 2011 – Yesterday the shareholders of SUSS MicroTec AG voted in favor of all resolution proposals put forward by the Management Board and Supervisory Board at this year's ordinary Shareholders' Meeting. In total, approximately 100 shareholders, shareholder and bank representatives, and guests joined the Company at the meeting in Munich. Thus, 23 % of the Company's equity capital was represented. In addition to discharging the Management Board and Supervisory Board from liability for the 2010 fiscal year and appointing auditors for the individual and consolidated financial statements, a resolution to the conversion of bearer shares to registered shares and related changes to the articles of incorporation as well as modification of authorizations was on the agenda. A resolution on the creation of new approved capital of € 6,500,000.00 with authorization for a partial subscription rights exclusion and a corresponding change in the articles of incorporation was on the agenda. Resolution for the approval of a profit and loss transfer agreement between SUSS MicroTec AG as the controlling company and SUSS MicroTec Lithography GmbH as the subordinate company was made. Finally there was a by-election of the supervisory board. Mr. Gerhard Pegam, CEO of EPCOS AG, will succeed Mr. Sebastian Reppegather as member of the supervisory board. In his statement of accounts, Chief Executive Officer Frank P. Averdung detailed the main developments and results of the past fiscal year and the first quarter of 2011. The focus of the report was on the investment and divestment projects in fiscal year 2010 as well as consolidation of the product lines Coater/Developer, Substrate Bonder and Photomask Equipment at the Sternenfels site in Germany. "By reducing our four manufacturing sites worldwide at the beginning of 2010 to two highly efficient sites by the beginning of 2011, we will be better positioned in the future to leverage synergies in research and development and in production," explained Mr. Averdung. The speech given by the Chief Executive Officer and the presentation regarding agenda item 1 of the invitation can be downloaded from the Company's homepage: www.suss.com/en/investor-relations/shareholder-meeting/2011.html Download the PDF version

Quarterly Figures for 2011 Published

Thu, 05 May 2011 08:00:00 +0200

Order Intake at EUR 48.3 million, which is 50% above Q1 2010
Sales plus 46% to EUR 32.0 million
EBIT at EUR 2.5 million after EUR -0.1 million in the prior year

Garching, May 5, 2011 – SUSS MicroTec AG published its report for the first quarter of the fiscal year 2011. The figures show that the company experienced an increase in both sales and order entry in the past quarter compared to Q1 2010. SUSS MicroTec generated sales of EUR 32.0 million, beating the previous year of EUR 21.9 million by approximately 46%. Order entry increased by 50% year on year to EUR 48.3 million.

The group's core division – Lithography – posted a 58% increase in sales to EUR 25.2 million (previous year: EUR 16.0 million) during the year under review. The Substrate Bonder division also succeeded in growing its revenues by approximately 50% to EUR 3.6 million (previous year: EUR 2.4 million). The Photomask Equipment division, acquired in early 2010, contributed sales of EUR 1.1 million (previous year: EUR 2.2 million).

Earnings before interest and tax (EBIT) of EUR 2.5 million could be achieved (previous year: EUR -0.1 million). This translates into an EBIT-margin of 7.8%. The EBIT in Q1 2011 was burdened by restructuring costs of € 1.0 million caused by the relocation of the Bonder product line from Waterbury, VT, USA to Sternenfels. The adjusted EBIT is € 3.5 million, which translates into an adjusted EBIT-margin of 10.8%. For the remainder of the fiscal year 2011 we expect final restructuring costs from this relocation of approximately € 1 million. Earnings after taxes (EAT) from continuing operations amounted to EUR 2.4 million, compared to EUR -0.7 million in the previous year. The basic earnings per share (EPS), therefore, totaled EUR 0.13 (previous year: EUR -0.04).

Cash and interest bearing securities amounted to EUR 50.3 million at the end of the first quarter. Net liquidity amounted to EUR 35.1 million (March 31, 2010: EUR 11.0 million). The Free Cash Flow for the fiscal year, before security transactions and extraordinary effects as well as M&A transactions, was EUR -2.2 (previous year’s quarter: EUR -1.3 Million).

Outlook

The Management Board confirms that it expects sales of more than EUR 170 million for the current fiscal year, 2011. The company also expects the EBIT-margin to improve compared with the previous year. As of today the free cash flow is expected to reach a double digit million Euro figure. For the first half year of the fiscal year 2011 the company expects sales of more than EUR 80 million.

Personnel

The Supervisory Board of SUSS MicroTec AG has extended the existing management contract with Mr. Frank P. Averdung, which was set to expire at the end of January 2012, ahead of schedule by an additional five years. In doing so, it has expressed its confidence in the work performed by Mr. Averdung (56). The electrical engineering graduate came to SUSS MicroTec AG at the beginning of February 2009 as President and Chief Executive Officer. He will now retain his position with the Company through January of 2017. Download the PDF version

Final Figures for 2010 Fiscal Year Published

Wed, 30 Mar 2011 08:00:00 +0200

Order Intake at EUR 189.3 million, which is 97 % above prior year
Sales plus 34 % to EUR 139.1 million
EBIT quintupled to EUR 14.3 million
Net liquidity increased to EUR 34.6 million

Garching, March 30, 2011 – SUSS MicroTec AG published its consolidated financial statements for the 2010 fiscal year today. The figures show that the company experienced a clear increase in both sales and order entry in the past fiscal year. Excluding the discontinued Test Systems division and including HamaTech APE, consolidated since March 2010, the SUSS MicroTec Group generated sales of EUR 139.1 million, beating the previous year's level of EUR 103.9 million by approximately 34%. Order entry increased significantly by 97% year on year to EUR 189.3 million (previous year: EUR 96.3 million). The group's core division – Lithography – posted a 15% increase in sales to EUR 88.9 million (previous year: EUR 77.6 million) during the year under review. The Substrate Bonder division also succeeded in growing its revenues by approximately 35% to EUR 24.7 million (previous year: EUR 18.3 million). The upswing in Lithography was largely due to the end of the general reluctance to make new investments as well as the increased demand from Asian production customers. The Substrate Bonder division benefited from the increasing importance of bonding equipment in the manufacturing process of MEMS, LED and future three-dimensional chip structures (3D integration). The Photomask Equipment division, acquired in early 2010, already contributed sales of EUR 18.4 million. Due to the sharp increase in sales, coupled with only moderate cost increases, the company was able to generate earnings before interest and tax (EBIT) of EUR 14.3 million for the last fiscal year, meaning a quintuplication from the previous years’ level of EUR 2.8 million. This translates into an EBIT-margin of 10.3%. The largest EBIT contribution came again from the Lithography division, but the new Photomask Equipment division also contributed positively to the EBIT. Only the division Substrate Bonder, burdened with restructuring expenses as well as strategically important orders with low margins, shows a negative result for 2010. Earnings after taxes (EAT) from continuing operations amounted to EUR 13.0 million, compared to EUR 0.5 million in the previous year. The basic earnings per share (EPS), therefore, totaled EUR 0.71 (previous year: EUR 0.03).

Liquidity

Cash and interest bearing securities amounted to EUR 50.1 million at the end of the 2010 fiscal year. Net liquidity has increased significantly by the end of 2010, amounting to EUR 34.6 million (December 31, 2009: EUR 18.4 million). The Free Cash Flow for the fiscal year, before security transactions and extraordinary effects as well as M&A transactions, was EUR 14.1 (previous year: EUR 8.9 Million).

Outlook

After three consecutive strong quarters in fiscal year 2010, the company again anticipates a strong order entry totaling approximately EUR 45 million for the first three months of 2011. For the first half year of the fiscal year 2011 the company expects sales of more than EUR 80 million. For the first three months of the current fiscal year sales are expected to be below EUR 35 million. The reason for this rather low sales figure is the current restructuring and relocation activity at the Sternenfels site, which lead to operational shortcomings in the first quarter. Additionally the company, as well as other companies, is currently faced with increased lead times from some suppliers. All in all, the Management Board expects sales of more than EUR 170 million for the current fiscal year, 2011. The Company also expects the EBIT-margin to improve compared with the previous year. As of today the free cash flow is expected to reach a double digit million Euro figure. Download the PDF version