SUSS News

SUSS MicroTec launches XBS300, the next generation Temporary Bonder for 200mm and 300mm High-Volume Production

Mon, 05 Dec 2011 17:30:00 +0100

“The XBS300 Temporary Bonding System is our answer to an increasing demand for processing systems that meet the requirements of future High Volume Production expected for 2013” — Frank Averdung, President and CEO, SUSS MicroTec

Garching, GERMANY, December 5, 2011 – SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, launched the XBS300 Temporary Bonder, SUSS MicroTec’s latest generation of high volume manufacturing temporary bond systems. This Bond Cluster is configured to temporarily bond 200mm and 300mm wafers for 3D integration applications as well as other processes that require thin wafer handling. SUSS MicroTec’s XBS300 offers a high throughput capability resulting in a superior cost-of-ownership as well as a sophisticated process control to meet customers’ demands and expectations for high volume temporary bonding applications. The temporary bonding of wafers is one of the crucial process steps of 3D integration.

The XBS300 supports all currently available temporary bonding adhesives. Its versatility allows a variety of process configurations suited for very low force bonds such as the Thin Materials (TMAT) process or the 3M™ Wafer Support System (WSS) as well as higher force thermo-compression bonds as used in the BrewerScience® ZoneBOND™ process. Key process steps for temporary bonding with the XBS300 include adhesive and release layer deposition, temporary bonding and curing and integrated metrology to determine the total thickness variation (TTV).

At this point in time a number of renowned material manufacturers are working on the development of new temporary bonding adhesives that are fully compatible with SUSS’ XBS300 equipment platform.

“The XBS300 Temporary Bonding System is our answer to an increasing demand for processing systems that meet the requirements of future High Volume Production expected for 2013,” says Frank P. Averdung, President and CEO of SÜSS MicroTec AG. “The XBS300 is based on our ACS300 Gen2 cluster platform, already established in the industry as proven workhorse for high volume production, ensuring high levels of efficiency and reliability. The utilization of this common platform strategy is one of the major gains from the geographic consolidation of three product lines under one roof in our Sternenfels facility. With the XBS300 - our latest innovation - we round off a product portfolio which perfectly addresses the future requirements of our customers.”

The first tool has already been delivered to a world leading IDM with the installation currently in progress. Download the pdf version

Brewer Science and SUSS MicroTec Jointly Commercialize ZoneBOND™ Technology for Thin Wafer Handling

Mon, 05 Dec 2011 00:00:00 +0100

Garching/Munich, GERMANY / ROLLA, MO, USA, December 05, 2011 – Brewer Science, Inc., the inventor of ZoneBOND™ technology and world leading expert in materials and processes for thin wafer handling, and SUSS MicroTec, a leading supplier of equipment, are joining forces in commercializing ZoneBOND™ technology for thin wafer handling. SUSS MicroTec, market leader in room temperature debonding process equipment, is now offering the Brewer Science ZoneBOND™ process on the XBC300 and XBS300 platforms, targeted for high volume bonding and debonding of 200/300mm wafers using silicon or glass carriers. Brewer Science offers products specifically designed for the successful implementation of the ZoneBOND™ process including materials for carrier preparation, adhesives, removers, as well as small scale debonding equipment. ZoneBOND™ technology is a break-through solution for wafer handling that provides excellent total thickness variation (TTV) control, high-temperature stability, and low-stress debonding. Customers will benefit through higher yield at debonding, higher throughput, and lower cost of ownership. This joint effort combines both companies’ expertise to provide a complete material, equipment and process solution, optimized for each individual customer’s process needs.

Cooperation of SUSS MicroTec and Swansea University’s Centre for NanoHealth

Thu, 24 Nov 2011 13:31:00 +0100

“Our innovative nano imprint solution will enable CNH to develop production processes on large area wafers which is the key to rapid transfer of prototype technologies to cost effective volume production and commercialisation.” — Frank Averdung, President and CEO, SUSS MicroTec

Garching (Germany) and Swansea (Great Britain), November 24, 2011 - SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, announces the cooperation with Swansea University´s Centre for NanoHealth (CNH). This cooperation is linked to CNH´s recent purchase of a SUSS Mask Aligner, MA/BA8 Gen3 with SCIL option. SCIL (Substrate Conformal Imprint Lithography) is a technology for large area imprint that enables patterning at nano scale, whilst maintaining consistent uniformity over entire wafer areas. The research of CNH is addressing challenges in healthcare such as developing next generation solutions to enable early intervention and detection of diseases followed by immediate identification of appropriate treatments. The Centre is backed by the European Regional Development Fund through the Welsh Government to address some of the biggest challenges facing the future of healthcare such as enhancing early intervention in diagnosing and treating diseases in non-hospital environments; in the home, community clinic or local doctors' surgery. This can be achieved through the use of devices such as biosensors to detect disease-relevant biomarker for heart disease, cancer, diabetes or other chronic conditions. The SUSS Mask Aligner will facilitate the processing of such novel technologies by applying micro/nano fabrication methods to produce biosensors, bioMEMS devices, microfluidics and photonics. “There are enormous opportunities in the biomedical industry. BioMEMS devices are the platform through which the nanomedicine applies.” states Frank P. Averdung, President and CEO of SÜSS MicroTec AG. “We believe that with the establishment of economical production processes the emerging bioMEMS segment is about to exceed the threshold to become a fast growing market. Our innovative nano imprint solution will enable CNH to develop production processes on large area wafers which is the key to rapid transfer of prototype technologies to cost effective volume production and commercialisation.” Dr. Matt Elwin, Centre Manager for the Centre for NanoHealth said, “The SUSS MicroTec Aligner will be an essential tool for the development of sensors and devices within the CNH, and there are already numerous projects vying for equipment time. The additional capabilities of SCIL will also open up new possibilities and we are excited about the potential of this new technique. SUSS MicroTec has made a significant contribution to the CNH project, and we are looking forward to developing its applications in the fabrication of new biosensors and medical devices.” Download the PDF version

A world leading integrated device manufacturer (IDM) selects SUSS MicroTec and TMAT for 300mm High-Volume Production of 3D Logic and Memory applications

Tue, 18 Oct 2011 17:58:00 +0200

Garching, GERMANY, October 18, 2011 – SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, and TMAT, a provider of process technology and adhesives for temporary bonding, have received a purchase order for SUSS MicroTec’s latest generation of high volume manufacturing temporary bond clusters from a world-leading IDM. The bonder system is configured to temporarily bond 300mm wafers for 3D integration processes for logic and memory applications using the TMAT adhesive materials and the TMAT process for temporary bonding. TMAT and SUSS MicroTec have been working on process and equipment qualification over the past months in order to adapt the process to the customer specific wafer and process requirements. SUSS MicroTec’s platform was chosen over competitors’ offerings because of the high throughput capability resulting in a superior Cost-of-Ownership and sophisticated process control for high production volume temporary bonding. Installation of the thin wafer handling equipment is scheduled for Q4 2011. About Thin Materials

Thin Materials AG was founded early 2007. The technology itself, however, is already under development for many more years and has reached market readiness. The company is based in Munich, Germany, where it has its office and clean room facilities. Any roadmap in the semiconductor industry shows a clear trend towards thinner wafers. While the goal is clear, the paths towards it are sometimes not. The handling of ultra-thin wafers (50 µm and less) is critical. Thin Materials AG has developed a carrier technology for ultra-thin wafers. Thin Materials´ technology allows to thin down wafers to 50 µm and less and to handle the thinned wafer on carrier in subsequent process steps like a “normal” wafer. The “Release Layer”, one of Thin Materials´ core technologies, allows the temporary wafer bonding and de-bonding at room temperature afterwards. High topography of 100 µm or more realized for example on bumped wafers can be handled by Thin Material's technology as well. The company is privately held by strategic and individual investors. More information can be found at the company’s website: www.thin-materials.com Download the pdf version

SUSS MicroTec AG: Divestment of SUSS MicroTec Precision Photomask Inc.

Mon, 17 Oct 2011 18:00:00 +0200

Garching, October 17, 2011 – The SUSS MicroTec AG has sold its mask manufacturing business - SUSS MicroTec Precision Photomask Inc. (formerly known as Image Technology Inc.) - in Palo Alto, California, on October 14, 2011 to Compugraphics Inc.. This move supports the expansion of the SUSS MicroTec Photo Mask Equipment business by eliminating competitive overlap with prospective customers. Synergies with the core equipment business were limited so that a deconsolidation will be possible easily. The divestment of the mask business is a further step of SUSS MicroTec to focus on its profitable and high growth core business areas. The transaction will have no effect on the consolidated income statement. Compugraphics Inc., a wholly owned subsidiary of OM Group, has acquired all the assets of SUSS MicroTec Precision Photomask Inc. and will continue operations in the US. Compugraphics is a globally acting mask manufacturer with mask shops in the US, UK and Germany. Download the pdf version

SUSS MicroTec introduces MaskTrack Pro InSync, a system for automated handling, storage and inspection of EUVL reticles expanding the Mask Integrity Infrastructure

Wed, 13 Jul 2011 17:00:00 +0200

“Only MaskTrack Pro InSync, delivers the technology necessary to achieve a zero particle mask management environment, enabling chipmakers to capitalize on important lithography scanner availability.” — Frank Averdung, President and CEO, SUSS MicroTec

Garching, July 13, 2011 – Today SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, launched its new MaskTrack Pro InSync - the first holistic in-fab EUVL mask management offering. MTP InSync is a stand-alone or clustered handling system which seamlessly synchronizes mask cleaning, handling, inspection and storage in a single controlled environment. MTP InSync operates in a zero particle regime maintaining perfect mask integrity when entering the vacuum environment of the EUVL Scanner. “EUV lithography places tremendous demands on mask integrity at point-of-exposure,” said Frank P. Averdung, President and CEO of SUSS MicroTec AG. “Only MaskTrack Pro InSync, delivers the technology necessary to achieve a zero particle mask management environment, enabling chipmakers to capitalize on important lithography scanner availability. This state-of-the-art mask management system establishes our continued commitment to providing our customers with a mask integrity infrastructure for Next Generation Lithography.” The MaskTrack Pro InSync is the first and only mask management system available in the market that can interface directly with the specific EUV Dual Pod in a fully-controlled environment. Designed to cluster mask cleaning, mask transfer and storage of the important inner pod in a pristine environment, as well as the optional integration of a particle detection system and inner pod cleaning, MTP InSync provides a unified approach to mask management throughout the lifetime of the mask. MTP InSync’s design allows the direct transfer of the Dual Pod from the scanner to the MaskTrack Pro reticle cleaning tool. Shipment of the first MTP InSync to imec in Belgium is scheduled in August 2011.

Precautionary measures for materials supplied from or through Japan

Tue, 12 Apr 2011 15:40:00 +0200

Garching, April 12, 2011 - The SUSS MicroTec Group takes its responsibility for the safety of personnel as well as delivered systems very seriously. Our suppliers in Japan are mainly located west and south of Tokyo and signal safe and stable supplies. However, SUSS MicroTec has initiated precautionary measures including radioactive substance testing of all materials from Japan. We aim for “zero contamination”. Machines and materials supplied by SUSS MicroTec are not only well below IATA or IMDG limitations but also below limits set by SEMI or legal limits.

Final Figures for 2010 Fiscal Year Published

Wed, 30 Mar 2011 08:00:00 +0200

Order Intake at EUR 189.3 million, which is 97 % above prior year
Sales plus 34 % to EUR 139.1 million
EBIT quintupled to EUR 14.3 million
Net liquidity increased to EUR 34.6 million

Garching, March 30, 2011 – SUSS MicroTec AG published its consolidated financial statements for the 2010 fiscal year today. The figures show that the company experienced a clear increase in both sales and order entry in the past fiscal year. Excluding the discontinued Test Systems division and including HamaTech APE, consolidated since March 2010, the SUSS MicroTec Group generated sales of EUR 139.1 million, beating the previous year's level of EUR 103.9 million by approximately 34%. Order entry increased significantly by 97% year on year to EUR 189.3 million (previous year: EUR 96.3 million). The group's core division – Lithography – posted a 15% increase in sales to EUR 88.9 million (previous year: EUR 77.6 million) during the year under review. The Substrate Bonder division also succeeded in growing its revenues by approximately 35% to EUR 24.7 million (previous year: EUR 18.3 million). The upswing in Lithography was largely due to the end of the general reluctance to make new investments as well as the increased demand from Asian production customers. The Substrate Bonder division benefited from the increasing importance of bonding equipment in the manufacturing process of MEMS, LED and future three-dimensional chip structures (3D integration). The Photomask Equipment division, acquired in early 2010, already contributed sales of EUR 18.4 million. Due to the sharp increase in sales, coupled with only moderate cost increases, the company was able to generate earnings before interest and tax (EBIT) of EUR 14.3 million for the last fiscal year, meaning a quintuplication from the previous years’ level of EUR 2.8 million. This translates into an EBIT-margin of 10.3%. The largest EBIT contribution came again from the Lithography division, but the new Photomask Equipment division also contributed positively to the EBIT. Only the division Substrate Bonder, burdened with restructuring expenses as well as strategically important orders with low margins, shows a negative result for 2010. Earnings after taxes (EAT) from continuing operations amounted to EUR 13.0 million, compared to EUR 0.5 million in the previous year. The basic earnings per share (EPS), therefore, totaled EUR 0.71 (previous year: EUR 0.03).

Liquidity

Cash and interest bearing securities amounted to EUR 50.1 million at the end of the 2010 fiscal year. Net liquidity has increased significantly by the end of 2010, amounting to EUR 34.6 million (December 31, 2009: EUR 18.4 million). The Free Cash Flow for the fiscal year, before security transactions and extraordinary effects as well as M&A transactions, was EUR 14.1 (previous year: EUR 8.9 Million).

Outlook

After three consecutive strong quarters in fiscal year 2010, the company again anticipates a strong order entry totaling approximately EUR 45 million for the first three months of 2011. For the first half year of the fiscal year 2011 the company expects sales of more than EUR 80 million. For the first three months of the current fiscal year sales are expected to be below EUR 35 million. The reason for this rather low sales figure is the current restructuring and relocation activity at the Sternenfels site, which lead to operational shortcomings in the first quarter. Additionally the company, as well as other companies, is currently faced with increased lead times from some suppliers. All in all, the Management Board expects sales of more than EUR 170 million for the current fiscal year, 2011. The Company also expects the EBIT-margin to improve compared with the previous year. As of today the free cash flow is expected to reach a double digit million Euro figure. Download the PDF version

Currently no major impact of the natural disaster in Japan on SUSS MicroTec

Thu, 17 Mar 2011 09:36:00 +0100

The sales and service office in Yokohama, which employs about 20 people from SUSS, has not been hit by the earthquake and the subsequent tsunami. All employees are well and the building, including the cleanroom facility, is undamaged. SUSS MicroTec currently generates between 5% and 7% of total sales in Japan, but does not have own production facilities there. The few SUSS suppliers, which are located in Japan, announced that they do not have any major production problems at the moment. Hence, SUSS MicroTec currently does not see a major impact on its business. This situation may change depending on the further developments in Japan, for example by ongoing restrictions in power supply or adverse effects on public transport.

SUSS MicroTec will be included in the TecDAX

Mon, 07 Mar 2011 13:41:00 +0100

Garching, Germany, March, 7 2011 - SUSS MicroTec will be included in the TecDAX, the leading index for publicly traded German technology companies. The stocks are selected according to market capitalization and trading turnover. SUSS MicroTec has improved in both categories over the last 6 month and now moved up into this important index from Deutsche Boerse in Frankfurt. This highlights the fact that SUSS MicroTec is a global leader of equipment manufacturing in the market segments Semiconductor, LED and MEMS. This move up into the TecDAX index makes the SUSS MicroTec shares even more attractive to investors and furthermore increases the awareness to international investors. Click here for the official announcement