Manual Mask Aligner - MA1006

Features and Benefits

  • From small pieces up to 6”
  • State of the Art for low budget
  • Very flexible, extremely robust
Overview

Wafer size

max. 150 mm Ø

Substrate size 

Max. 150 x 150 mm 

Thickness 

0 –5 mm 

Mask size 

max. 7” x 7” 

Exposure optics

UV400: 350 nm – 450 nm 

Hg-lamp: 350W / 1000W 

UV300: 280 nm – 350 nm 

Hg-lamp: 350W / 1000W 

Uniformity 

± 5% for 150 mm wafers 

Splitfield Video Camera system

Image storage system

SUSS MicroTec DSS02 

Camera 

CCD 2/3” chip 

Monitor 

Screen 10” – 15” 

Optics

Zoom factor nom. 

5x 35x 

Zoom factor visual - 14” monitor

150x – 1000x 

Exposure program

Proximity 

 

Soft contact 

 

Hard contact 

 

Vacuum contact 

 

Photo Gallery

MA1006-web

Information Material

More Information needed?