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- MA150
Production Mask Aligner MA150
Features and Benefits
- 6” high-performance production mask aligner
- High throughput and high yield
- PC control with plasma touch screen operation
- Wafer size 2” up to 6”
Wafer size | 3” – 150mm |
|---|---|
Substrate size | 3” x 3” – 6” x 6” |
Exposure optics | |
UV400 350 – 450 nm | Hg-Lamp 350W / 1000W |
UV300 280 – 350 nm | Hg-Lamp 350W / 1000W |
UV250 240 – 260 nm | Cd-Xe Lamp 350W |
UV249 249 nm | Excimer laser |
UV193 193 nm | Excimer laser |
10W average power at 193 nm | |
7,5W average power at 193 nm | |
Stabilized | |
Uniformity (150 mm dia.) | ± 5% |
Exposure Modes | |
Proximity: | |
Alignment/ Exposure distance (selectable in 1 µm steps) | 0 – 999 µm |
Soft contact: | |
Adjustable contact pressure | 0.03 – 0.07 N/cm² |
Hard contact: | |
Adjustable contact pressure between chuck and wafer via nitrogen | 0.04 – 0.16 N/cm² |
Vacuum contact: | |
Max. diameter | 150mm |
