Manual Mask Aligner - MA150M

Features and Benefits

  • For laboratory, research & development, for small scale or pilot production
  • 6” mask aligner with manual substrate handling
  • PC control with plasma touch screen operation
  • Wafer size 2” up to 6”
Overview

Wafer size

Partial Wafers – 150 mm

Substrate size

Partial Substrates – 6” x 6”

Exposure optics

UV400 350 – 450 nm

Hg-Lamp 350W / 1000W

UV300 280 – 350 nm

Hg-Lamp 350W / 1000W

UV250 240 – 260 nm

Cd-Xe Lamp 350W

UV249 249 nm

Excimer laser

UV193 193 nm

Excimer laser

10W average power at193 nm

7,5W average power at193 nm

Stabilized

Uniformity (150 mm dia.)

± 5%

Exposure Modes

Proximity:

Alignment/ Exposure distance (selectable in 1 µ m steps)

0 – 999 µ m

Soft contact:

Adjustable contact pressure

0.03 – 0.07 N/cm²

Hard contact:

Adjustable contact pressure between chuck and wafer via nitrogen

0.04 – 0.16 N/cm²

Photo Gallery

ma150m

Information Material

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