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- MA200
Production Mask Aligner MA200
Features and Benefits
- Wafers and substrate size 4” x 4” up to 8” x 8”
- Multi-Chip modules
- 8” cassette-to-cassette aligner
- Automatic alignment optional
Wafer size | up to 200 mm |
Substrate size | up to 8” x 8” |
Exposure modes | |
|---|---|
Proximity : |
|
Alignment / Exposure distance | 0 – 999 µm (selectable in 1 µ m steps) |
Soft contact : | |
Adjustable contact pressure | 0.03 – 0.07 N/cm² |
Hard contact : | |
Adjustable contact pressure between chuck and wafer (using Nitrogen) | 0.04 – 0.16 N/cm² |
Exposure system | |
Standard spectral range | UV400: 350 – 450 nm |
High collimation optics, Exposure area | 200 mm diameter or 8” x 8” |
Intensity | 25 – 30 mW/cm² @ 405 nm |
15 – 20 mW/cm² @ 365 nm | |
Uniformity | ± 3% for 200 mm wafers |
± 5% for 8” x 8” substrates | |
Constant Intensity power supply CIC1000 | |
