C4NP Technology Explained
Katharine Frase, Vice President, Worldwide Packaging, IBM"C4NP is an example of IBM's commitment to semiconductor packaging technology innovation and leadership, and can fundamentally change the traditional roadmap of the industry. [It] will enable IBM and other semiconductor manufactures to implement a 100 percent lead-free solder bumping technology as an integral part of their wafer assembly, packaging and test solution portfolios"
With C4NP alloy-independent solder balls are created in molds ready to be transferred to the wafer in one easy step. This has the following advantages:
- Low material cost - uses bulk alloy without converting to paste, pre-form, chemical solution
- Alloy independence - especially beneficial for ternary and quaternary lead-free alloys
- Efficient solder usage - environmental and economic benefits, especially with costlier alloys
- No volume change - finer bump size & pitch possible than with paste
- Parallel processing - the bumps can be prepared while the wafer is in process reducing manufacturing cycle time, time to market
- High yield with bump inspection capability and known good bumps prior to transfer
- Simple processing - no complex plating required
Click here for a comparison of C4NP with other bumping processes
Click here to see the process flow for C4NP
For more detailed information about the revolutionary C4NP process, download the articles on the left
