SUSS Technology Forum at Semicon West

Industry experts will address the status of the 3D TSV infrastructure and recent advances in 3D processing... read more

Lithography Plus

SUSS MicroTec offers a broad product range to meet the different price and performance points required by the... read more

卓越工程－ 經久耐用！

SUSS MicroTec所提供的每一台翻新機台都符合我們超高的品質及精密標準。每一系統均按照原始技術規範和性能資料進行配置。 read more

Over 60 Years of Engineering Experience

SUSS MicroTec Group is a supplier of equipment and process solutions for microstructuring applications with more than... read more

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SUSS MicroTec在工程領域擁有超過60年的豐富經驗，為半導體產業及相關市場之微架構製程設備的領導供應商。

我們的服務為提供最全方位的半導體設備組合及解決方案，包括後段微影、晶圓接合與前段的光罩製程設備並提供各式微光學元件。

News
29.05.2013
Dow Corning and SUSS MicroTec Report New Temporary Bonding Solution for 2.5D and 3D IC Packaging at ECTC 2013
17.04.2013
Environment friendly Laser Processing in Advanced Packaging gains Pace - Leading US-American IDM places Order for Excimer Laser Ablation Tool
28.03.2013
A World Leading IDM places a follow up order for Bonding-Equipment for 300mm High-Volume Production
05.03.2013
Rolith and SUSS MicroTec Announce Installation of 2nd Generation Nanolithography Tool
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