The SUSS MicroTec Group is a leading supplier of equipment and process solutions for microstructuring applications with more than sixty years of engineering experience.
The solution portfolio covers all performance relevant steps for wafer processing:
- Spin Coating and Spray Coating
- Wafer Bonding
- Temporary Wafer Bonding
- Imprint Lithography
- Laser Processing
- Plasma Treatment
- Alignment Verification
- Photomask Cleaning
The production of memory chips, cameras for mobile phones or tire pressure sensors – the equipment solutions of SUSS MicroTec are applied within a wide variety of manufacturing processes for applications of daily or industrial use. Customers in the semiconductor industry and related markets like MEMS and LED appreciate our comprehensive experience in wafer processing. This makes us a valuable partner for high-volume production as well as for research and development.