SUSS MicroTec has had a long and distinguished history of product and technical innovations - starting with the development of the first ever Mask Aligner in 1963. Over the years SUSS MicroTec has launched many industry firsts such as the first fully automatic bond cluster, the first ever 300 mm prober or the GYRSET closed cover coating technology for fringe-free coating with reduced resist consumption. SUSS MicroTec was also the first to discover that proximity full field lithography is the best possible solution for thick resist applications such as MEMS and wafer-level packaging.
Most recently the company has been found at the forefront of process development for TSV 3D Integration. SUSS MicroTec teamed up with various material suppliers to provide a wide range of process solutions for challenging thin wafer handling and de-bonding processes to its customers.