BA8 Gen3

Industry Leading Precision Bond Alignment

High post-bond alignment accuracy requires precision alignment. The next generation BA8 bond aligner represents the latest development of SUSS MicroTec‘s manual bond aligner platform that aligns all wafers and substrates from 1 inch to 8 inch precisely regardless of the bonding method used. The BA8 Gen3 accommodates even most demanding alignment processes in MEMS and LED production and growth markets like 3D integration.

Downloads & Contact

Product Brochure	Product Datasheet