Permanent Wafer Bonder
XBC300 Gen2
Permanent Bonding and Debonding / Cleaning Solution for 3D Integration Processes
The SUSS XBC300 Gen2 Wafer Bonder, designed for process development and production offers both, low cost of ownership and process flexibility with full automation. The 300 mm platform is configurable for all major permanent bonding and debonding / cleaning processes for 3D integration and 3D packaging through a wide selection of process modules.
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