Automated Platform for Wafers of up to 300mm
用于晶圆片级封装的旋涂/显影一体机
Automated Platform for Wafers up to 200mm
适用于崎岖表面的手动喷雾涂胶机
RCD8涂胶显影平台
实验室涂胶显影方案，最大尺寸6”到8”
Hot Plate Designed for R&D, Laboratories and Small Scale Production
12英寸喷淋显影系统
手动12英寸金属剥离系统
Highly Automated Platform for 300mm and 200mm Wafers
应用广泛的对准和曝光工艺
Automated Platform for Wafers up to 100mm or 150mm
用于工业研究和低成本生产的手动光刻机
For Industrial Research and Operator-Assisted Production
Semi-Automated Platform for Wafers up to 8"/200mm
手动光掩模及键合对准机
小尺寸基片的最新研发解决方案
High Performance Projection Scanner for 300 mm Wafers
投影扫描器 DSC500
准分子激光步进机ELP300
Automated Platform for Wafer Sizes up to 200 mm
更灵活的开放平台
适用于大批量生产的通用型临时键合机
Manual Bond Aligner Wafer Sizes up to 8"/200 mm
High Precision Bond Aligner
Semi-Automated Excimer Laser Debonder
Semi-automated Tool for Permanent Wafer Bonding of Wafers up to 8"/200 mm
用于高粘结力晶片粘结过程的
Next-Generation Lithography | Clean, Bake and Develop
Photomask Processing Plattform for Advanced Bake, Resist Strip & Clean and Develop
Manual Photomask Processing
高品质微光学元件
二手设备认证