Electronic Components and Technology Conference

Lake Buena Vista, FL, USA

Visit SUSS MicroTec at the Electronic Components and Technology Conference and discuss latest developments and future directions of packaging, components and microelectronic systems. Meet our experts and address questions about materials, equipment and processing of your application. For more information visit www.ectc.net.

Don't Miss the Opportunity to Attend our Presentations

Session 19: Recent Advances in FOWLP Technology: Thursday, June 1, 1:55 p.m.

"Innovative Excimer Laser Dual Damascene Process for Ultra-Fine Line Multilayer Routing with 10µm Pitch Micro-Vias for Wafer-Level and Panel-Level Packaging"

Session 19: Recent Advances in FOWLP Technology: Thursday, June 1, 2:20 p.m.

"Embedded Trench Redistribution Layers (RDL) by Excimer Laser Ablation and Surface Planer Processes"

2017 May. 30 - 02
Lake Buena Vista, FL, USA
www.ectc.net