Electronic Components and Technology Conference
Visit SUSS MicroTec at the Electronic Components and Technology Conference and discuss latest developments and future directions of packaging, components and microelectronic systems. Meet our experts and address questions about materials, equipment and processing of your application. For more information visit www.ectc.net.
Don't Miss the Opportunity to Attend our Presentations
Session 19: Recent Advances in FOWLP Technology: Thursday, June 1, 1:55 p.m.
"Innovative Excimer Laser Dual Damascene Process for Ultra-Fine Line Multilayer Routing with 10µm Pitch Micro-Vias for Wafer-Level and Panel-Level Packaging"
Session 19: Recent Advances in FOWLP Technology: Thursday, June 1, 2:20 p.m.
"Embedded Trench Redistribution Layers (RDL) by Excimer Laser Ablation and Surface Planer Processes"