EMPC

Visit SUSS MicroTec at the 22nd Microelectronics and Packaging Conference (EMPC) & Exhibition in Pisa, Italy and discuss latest developments and future directions of microelectronics packaging and interconnection technologies. Meet our experts and address questions about materials, equipment and processing of your application. We do not have a booth but are experts will be there. Contact us to arrange a meeting

Sep. 16 - Sep. 19, 2019
Pisa, Italy
www.empc2019.org