International Conference on Electronics Packaging and iMAPS All Asia Conference

Visit SUSS MicroTec at International Conference on Electronics Packaging and iMAPS All Asia Conference in Kuwane, Mie in Japan and discuss latest developments and future directions electronic packaging. Meet our experts and address questions about materials, equipment and processing of your application. For more information visit www.jiep.or.jp/icep

Apr. 17 - Apr. 21, 2018
Kuwane, Mie, Japan
www.jiep.or.jp/icep