Visit SUSS MicroTec at the International Wafer-Level Packaging Conference IWLPC and discuss latest developments and future directions of packaging, components and microelectronic systems. Meet our experts and address questions about materials, equipment and processing of your application. For more information visit http://www.iwlpc.com.
Don't Miss the Opportunity to Attend our Presentations
- Tuesday, October 23 | 4:00 pm - 4:30 pm | Venue: Cedar |Session 6: New Methods and Materials | Track 3: Advanced Manufacturing
Fine RDL Formation Using Alternative Patterning Solution for Advanced Packaging
Habib Hichri, Ph.D. | SUSS MicroTec Inc
- Wednesday, October 24 | 11:00 am - 11:30 pm | Venue: Oak | Session 7: Wafer Level Fan-Out Process & Metrology | Track 1: WLP
Optical Run-Out Correction for Improved Lithography Overlay Accuracy for FOWLP Applications
Dr. Markus Arendt | SUSS MicroTec Photonic Systems Inc.