Visit SUSS MicroTec at the International Wafer-Level Packaging Conference IWLPC and discuss latest developments and future directions of packaging, components and microelectronic systems. Meet our experts and address questions about materials, equipment and processing of your application. For more information visit http://www.iwlpc.com.



Don't Miss the Opportunity to Attend our Presentation

Electrical and Reliability of Ultra-fine Line Multi-Redistribution Layers Enabled by an Innovative Excimer Laser Dual Damascene Process for Wafer-Level Packaging

Habib Hichri, SUSS MicroTec Photonic Systems Inc.

Oct. 24 - Oct. 26, 2017
San Jose, CA, USA
Booth #13