Visit SUSS MicroTec at Semicon Europa and discuss latest developments and future directions of packaging, components and microelectronic systems. Meet our experts and address questions about materials, equipment and processing of your application. For more information visit

Don't Miss the Opportunity to Attend our Presentation

  • Wednesday, November 13 | Session 4: New Materials and Processing in Packaging | 12:20
    Advanced Plasma Surface Activation for Hybrid Fusion Bonding
    Thomas Schmidt | Product Manager Boder | SUSS MicroTec
Nov. 12 - Nov. 15, 2019
Munich, Germany