SEMICON Taiwan

Visit SUSS MicroTec at SEMICON Taiwan and discuss latest developments and future directions of packaging, components and microelectronic systems. Meet our experts and address questions about materials, equipment and processing of your application. For more information visit http://www.semicontaiwan.org/en/.


Don't Miss the Opportunity to Attend our Presentations:

MEMS & Sensors Forum

Topic:

Novel Method for Improved Post – Bond Alignment in Wafer-Bonding for High-Volume Production for Automotive and Consumer Application

Presenter:

Mr. Stefan Lutter

Date:

September 13, 2017 Wednesday

Time:

08:30 – 16:25 (8:30-9:00 for Registration)

SUSS Presentation:

10:45 – 11:10

Venue:

Grande Luxe Banquet Grand Ballroom, Taipei, Taiwan

Advanced Packaging Technology Symposium

Topic:

SUSS High Throughput UV Projection Scanner with optimized Performance for FOWLP Application

Presenter:

Dr. Markus Arendt

Date:

September 13, 2017 Wednesday

Time:

09:00 – 16:45 (9:00-9:20 for Registration)

SUSS Presentation:

14:25 – 14:50

Venue:

Grande Luxe Banquet Grand Ballroom, Taipei, Taiwan

SiP Global Summit 2017 – Embedded and Fan Out Package Technology Forum

Topic:

Reliability of Ultra-fine Line Multi-Redistribution Layers Enabled by Excimer Laser Dual Damascene Process for Wafer and Panel Level Packaging

Presenter:

Dr. Habib Hichri

Date:

September 15, 2017

Time:

08:30 – 16:55 (8:30-08:50 for Registration)

SUSS Presentation:

14:35 – 15:00

Venue:

Grande Luxe Banquet Grand Ballroom, Taipei, Taiwan

 

 

 

Sep. 13 - Sep. 15, 2017
Taipei, Taiwan
Booth #376
www.semicontaiwan.org