Visit SUSS MicroTec at SEMICON Taiwan and discuss latest developments and future directions of packaging, components and microelectronic systems. Meet our experts and address questions about materials, equipment and processing of your application. For more information visit http://www.semicontaiwan.org/en/.
Don't Miss the Opportunity to Attend our Presentation
"Novel Method for Improved Post-Bond Alignment in Wafer Bonding for High Volume Production of MEMS Sensors for Automotive- and Consumer Applications"