Visit SUSS MicroTec at SEMICON Taiwan and discuss latest developments and future directions of packaging, components and microelectronic systems. Meet our experts and address questions about materials, equipment and processing of your application. For more information visit

Don't Miss the Opportunity to Attend our Presentations

Advanced Packaging Technology Symposium   |   Wednesday, September 13   |   14:25

SUSS High Throughput UV Projection Scanner with optimized Performance for FOWLP Application
Dr. Markus Arendt, SUSS MicroTec

MEMS & Sensors Forum   |   Thursday, September 14   |   10:45

Novel Method for Improved Post-Bond Alignment in Wafer Bonding for High Volume Production of MEMS Sensors for Automotive- and Consumer Applications
Margarete Zoberbier, SUSS MicroTec
Sep. 13 - Sep. 15, 2017
Taipei, Taiwan
Booth #376