We are very pleased to announce our participation in the upcoming ICEP event, the most important international conference on electronic packaging to be held in Japan. As the largest gathering of its kind, ICEP boasts over 360 attendees and 35 technical sessions, providing an unparalleled platform to showcase our cutting-edge technologies and products. The conference covers a wide range of topics including advanced packaging, design, modeling, reliability, emerging technologies, high speed, wireless & components, interconnects, materials and processes, optoelectronics, power electronics integration, and thermal management. Join us at our booth. Talk to our experts about your specific needs.

Date: Apr 17, 2024 - Apr 19, 2024
Location: Toyama, Japan