IMAPS Device Packaging Conference
Are you ready to join us at the 20th Annual Device Packaging Conference (DPC 2024), the premium event organized by the International Microelectronics Assembly and Packaging Society (IMAPS)? From March 18-21, 2024, it will feature speakers across three tracks: Heterogeneous 2D & 3D Integration; Fan-Out, Wafer Level Packaging & Flip Chip; Next Gen Applications (Automotive, 5G/6G and more). Discover the latest developments and opportunities in the device packaging industry and don't miss out. See how our innovative solutions can help you achieve your packaging goals at our booth. We look forward to seeing you at our booth #42 and sharing our passion for packaging excellence.