Strategically important order for LithoPack300

Strategically important order for LithoPack300

START_OF_TAGbEND_OF_TAGSUSS MicroTec: Strategically important order for LithoPack300START_OF_TAG/bEND_OF_TAGSTART_OF_TAGbrEND_OF_TAGSTART_OF_TAGbrEND_OF_TAGSTART_OF_TAGBREND_OF_TAG.Order from one of the world's largest semiconductor packaging and testing companies in TaiwanSTART_OF_TAGBREND_OF_TAG.Furtherly strenthened market position in high-volume production applicationsSTART_OF_TAGbrEND_OF_TAGSTART_OF_TAGbrEND_OF_TAGSTART_OF_TAGBREND_OF_TAGMunich, January 9, 2002- SUSS MicroTec has won a key order for the LithoPack 300 cluster tool from the one of the world's largest semiconductor packaging and testing companies in Taiwan. SUSS MicroTec's LithoPack300 was chosen over alternative technologies due to the highly integrated solution which improves throughput, quality and reliability while reducing cost on advanced technology products such as high performance graphic chips, microprocessors, wireless communications and portable consumer electronics.START_OF_TAGBREND_OF_TAGSTART_OF_TAGBREND_OF_TAGThe LithoPack300 is a fully automated and integrated cluster solution used to coat, expose and develop patterned wafers for wafer level packaging (WLP) applications. According to Franz Richter, CEO of SUSS MicroTec 'this strategically important order continues to validate our strategy of offering a high-volume production platform which provides a total system solution to our customers and further strengthens our market position'.START_OF_TAGBREND_OF_TAGSUSS MicroTec's 300-mm cluster solution consists of an MA300 Mask Aligner module linked to an ACS300 Spin Coating system. The tool, called the LithoPack300 (LP300), is specifically designed for wafer bumping and wafer level packaging applications on 300mm wafers. The 300mm technology is - in contrast to the currently used 200mm technology - the next generation in semiconductor production and allows chip companies to increase cost efficiency in their production.START_OF_TAGBREND_OF_TAGSTART_OF_TAGBREND_OF_TAGFor further information, please contact: Barbara v. Jan, Investor Relations, Tel.: +49(0)89-32007314START_OF_TAGBREND_OF_TAG